|Title:||Simulation of laser splitting of bilayer structures made of silicon wafers and glass substrates|
|Publisher:||F. Skorina Gomel State University|
|Citation:||Nikitjuk, Y.V. Simulation of laser splitting of bilayer structures made of silicon wafers and glass substrates / Y.V. Nikitjuk, A.N. Serdyukov, I.Y. Aushev // Inter-Academia 2021 : the 19th International Conference on Global Research and Education (Gomel, Belarus, 20 – 22 October, 2021) / S.A. Khakhomov, I.V. Semchenko, O.M. Demidenko, D.L. Kovalenko, A.A. Sereda, T.V. Lozovskaya ; F. Skorina Gomel State UniversityGomel. - Gomel, 2021 - P. 120-122.|
|Abstract:||The paper presents the results of a finite-element simulation of the laser splitting process of bilayer structures of monocrystalline silicon and glass under the influence of laser beams with wavelengths equal to 0.808 μm and 10.6 μm and a refrigerant on the workpiece. The calculation of thermoelastic fields formed in a bilayer wafer as a result of laser heating was performed for three cuts of silicon crystals, i.e. (100), (110), (111). The outcomes of this research can be used to optimize the process of laser separation of bilayer structures of monocrystalline silicon and glass.|
|Appears in Collections:||Статьи|
Files in This Item:
|Nikitjuk_Serdyukov_Aushev_Simulation_of_laser.pdf||523.54 kB||Adobe PDF||View/Open|
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.