Simulation of laser splitting of bilayer structures made of silicon wafers and glass substrates

Abstract

The paper presents the results of a finite-element simulation of the laser splitting process of bilayer structures of monocrystalline silicon and glass under the influence of laser beams with wavelengths equal to 0.808 μm and 10.6 μm and a refrigerant on the workpiece. The calculation of thermoelastic fields formed in a bilayer wafer as a result of laser heating was performed for three cuts of silicon crystals, i.e. (100), (110), (111). The outcomes of this research can be used to optimize the process of laser separation of bilayer structures of monocrystalline silicon and glass.