| Название: | Modeling of mechanical influence of double-beam laser on single-crystalline silicon |
| Авторы: | Shalupaev, S.V. Serdyukov, A.N. Mityurich, G.S. Aleksiejuk, M. Nikitjuk, Y.V. Sereda, A.A. Шалупаев, С.В. Сердюков, А.Н. Митюрич, Г.С. Алексиюк, М. Никитюк, Ю.И. Середа, А.А. |
| Ключевые слова: | laser cutting thermoelastic stresses silicon wafers crack |
| Дата публикации: | 2013 |
| Библиографическое описание: | Modeling of mechanical influence of double-beam laser on single-crystalline silicon / S.V. Shalupaev, A.N. Serdyukov, G.S. Mityurich, M. Aleksiejuk, Y.V. Nikitjuk, A.A. Sereda // Archives of Мetallurgy and Мaterials. - 2013. - Vol. 58, № 4. - Р. 1381-1385. |
| Краткий осмотр (реферат): | The results of finite-element modeling of controlled laser thermosplitting of crystalline silicon are presented. The case of treatment by two laser beam with wavelengths, namely 0.808 m and 1.06 m is studied. Calculations of the thermoelastic fields formed in a single-crystalline silicon wafer as a result of consecutive two-beam laser heating and action of coolant were performed for silicon crystalline orientations: (100), (110), (111). Modeling was performed for circular and U-shaped laser beams. The results received in the presented work, can be used for the process optimization concerning the precise separation of silicon wafers by laser cutting. |
| URI (Унифицированный идентификатор ресурса): | http://elib.gsu.by/handle/123456789/7417 |
| ISSN: | 1733-3490 |
| Располагается в коллекциях: | Статьи |
Файлы этого ресурса:
| Файл | Описание | Размер | Формат | |
|---|---|---|---|---|
| [Archives of Metallurgy and Materials] Modeling of Mechanical Influence of Double-Beam Laser on Single-Crystalline Silicon.pdf | 568.26 kB | Adobe PDF | Просмотреть/Открыть |
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